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SiO2/CuOx/Ni81Fe19 bilayer

Based on

1 Articles
2016 Most recent source

Composition

Image only illustrates the order and placement of components as described in literature.

1

copper oxide

Type Single Compound
Formula CuO(x)
Role layer
2

iron-nickel alloy

nickel-iron alloy iron nickel alloy nickel ferrite FeNi alloy Permalloy permalloy Py
Type Single Compound
Formula Ni81Fe19
Role layer
3

silicon dioxide

silicic oxide silica
Type Single Compound
Formula SiO2
Role layer

Properties

General physical and chemical properties

Property Value Nanomaterial Variant Source
electrical resistivity

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Applications

Area Application Nanomaterial Variant Source
electronics

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Preparation

Method 1

Type: Chemical synthesis
Source:
Starting materials
  • copper
  1. l8tnp4pLvrfbH3nhiyHkiDR6N3m4WtuTs9M3kom
  2. pgHDaV7Iu
Product

SiO2/CuOx/Ni81Fe19 bilayer

Thickness: 12 nm

Medium/Support: none

Method 2

Type: Chemical synthesis
Source:
Starting materials
  • copper
  1. GBGwIcO4fb6wOSR2BAtAAzc93Jv7t7muFWyrEyK
  2. ClDIcwwDN
Product

SiO2/CuOx/Ni81Fe19 bilayer

Thickness: 10 nm

Medium/Support: none

Method 3

Type: Chemical synthesis
Source:
Starting materials
  • copper
  1. aqqAWVQUPcqzbhHg20o1ioK2N8hIpks4s2oPL8N
  2. ixHCGNXZK
Product

SiO2/CuOx/Ni81Fe19 bilayer

Thickness: 6 nm

Medium/Support: none

Method 4

Type: Chemical synthesis
Source:
Starting materials
  • copper
  1. gI1UWOOmnmKFKNCwqG7L4d7iWDwf6xaj3p9XjOs
  2. JR4A59twB
Product

SiO2/CuOx/Ni81Fe19 bilayer

Thickness: 15.9 nm

Thickness: 4 nm

Thickness: 8 nm

Medium/Support: none

Method 5

Type: Chemical synthesis
Source:
Starting materials
  • copper
  1. A6ITc0Mn73eGdukmXVwS3iMPNBgMHuOuJgbbMFA
  2. 8cHH38VjH
Product

SiO2/CuOx/Ni81Fe19 bilayer

Thickness: 15 nm

Medium/Support: none

References

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