Loading ...

3D composite microarchitecture

Based on

1 Articles
2014 Most recent source

Composition

1

IP-Dip photoresist

Type Polymer
Formula
Role core
2

aluminium oxide

aluminum oxide alumina
Type Single Compound
Formula Al2O3
Role layer

Properties

General physical and chemical properties

Property Value Nanomaterial Variant Source
compressive strength

More information/entries available to subscribers only.

Or, view sample content

Characterization

Method Nanomaterial Variant Source
scanning electron microscopy

More information available to subscribers only.

Or, view sample content

Preparation

Method 1

Type: Physical formation
Source:
Starting materials
  • IP-Dip photoresist
Product

3D composite microarchitecture

Thickness: ~ 50 nm

Medium/Support: none

Method 2

Type: Physical formation
Source:
Starting materials
  • IP-Dip photoresist
Product

3D composite microarchitecture

Thickness: ~ 100 nm

Medium/Support: none

Method 3

Type: Physical formation
Source:
Starting materials
  • IP-Dip photoresist
Product

3D composite microarchitecture

Thickness: ~ 100 nm

Medium/Support: none

Method 4

Type: Physical formation
Source:
Starting materials
  • IP-Dip photoresist
Product

3D composite microarchitecture

Edge length: ~ 3000 nm

Height: ~ 10000 nm

Thickness: 10 nm

Medium/Support: none

Method 5

Type: Physical formation
Source:
Starting materials
  • IP-Dip photoresist
Product

3D composite microarchitecture

Thickness: ~ 50 nm

Medium/Support: none

References

Full content is available to subscribers only

To view content please choose from the following:


Sign up for a free trial