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epoxy resin/nano-clay platelets/DMMP/curing agent ink composition

Based on

1 Articles
2014 Most recent source

Composition

Image only illustrates the order and placement of components as described in literature.

1

Epon 826 epoxy resin

Type Polymer
Formula
Role binder
2

nano-clay platelets

Type Nano Material
Formula
Role fillers
3

dimethyl methyl phosphonate

DMMP
Type Single Compound
Formula C3H9O3P
Role fillers
4

imidazole-based ionic liquid

Basionics VS03
Type Complex Compound
Formula
Role fillers

Properties

General physical and chemical properties

Property Value Nanomaterial Variant Source
loss modulus

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Applications

Area Application Nanomaterial Variant Source
raw materials/precursors/templates

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Preparation

Method 1

Type: Physical formation
Source:
Starting materials
Product

epoxy resin/nano-clay platelets/DMMP/curing agent ink composition

Size: not specified

Medium/Support: none

References

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