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silica nanoparticle-loaded trichloro(1H, 1H, 2H, 2H-perfluorooctyl)silane, nickel-coated silicon wafer

Based on

1 Articles
2015 Most recent source

Composition

Image only illustrates the order and placement of components as described in literature.

1

silicon wafer

Si wafer
Type Complex Compound
Formula
Role raw materials
2

nickel

Type Single Compound
Formula Ni
Role layer
3

silicon dioxide

silicic oxide silica
Type Single Compound
Formula SiO2
Role loaded material
4

trichloro(3,3,4,4,5,5,6,6,7,7,8,8,8-tridecafluorooctyl)silane

(tridecafluoro-1,1,2,2-tetrahydrooctyl)-1-tricholorosilane (1H,1H,2H,2Htetrahydrotridecafluorooctyl)-trichlorosilane tridecafluoro, 1, 1,2,2-tetrahydrooctyl-1-trichlorosilane (tridecafluoro-1,1,2,2-tetrahydrooctyl)trichlorosilane tridecafluoro-1,1,2,2(tetrahydrooctyl)trichlorosilane tridecafluoro-1,1,2,2-tetrahydrooctyl)trichlorosilane (1H,1H,2H,2H-tridecafluorooctyl)-trichlorosilane trichloro(1H, 1H, 2H, 2H-perfluorooctyl)silane trichloro[1H-,1H-,2H-,2H-perfluorooctyl]silane (1H,1H,2H,2H)-perfluorooctyl-trichlorosilane (1H,1H,2H,2H-perfluorooctyl)-trichlorosilane trichloro(1H,1H,2H,2H-perfluorooctyl) silane trichloro-(1H,1H,2H,2H-perfluorooctyl)silane (1H,1H,2H,2H)-perfluorooctyltrichlorosilane 1H,1H,2H,2H-perfluorooctyl- trichlorosilane trichloro(1H,1H,2H,2H-perfluorooctyl)silane 1H,1H,2H,2H-perfluorooctyl-trichlorosilane 1H,1H,2H,2H-perfluorooctyltrichlorosilane perfluorohexylethyltrichlorosilane perfluorooctyl trichlorosilane perfluorooctyltrichlorosilane PFOCTS PFOTS FOTS PFTS PFOS TPOS 13F FTS PFS
Type Single Compound
Formula C8H4Cl3F13Si
Role layer

Characterization

Method Nanomaterial Variant Source
scanning electron microscopy

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Preparation

Method 1

Type: Physical formation
Source:
Starting materials
  • silicon wafer
Product

silica nanoparticle-loaded trichloro(1H, 1H, 2H, 2H-perfluorooctyl)silane, nickel-coated silicon wafer

Size: ~ 20 nm

Thickness: 50 nm

Trench spacing: 7000 nm

Trench width: 9000 nm

Medium/Support: none

Method 2

Type: Physical formation
Source:
Starting materials
  • silicon wafer
Product

silica nanoparticle-loaded trichloro(1H, 1H, 2H, 2H-perfluorooctyl)silane, nickel-coated silicon wafer

Size: ~ 20 nm

Thickness: 50 nm

Trench spacing: 2500 nm

Trench width: 1300 nm

Medium/Support: none

Method 3

Type: Physical formation
Source:
Starting materials
  • silicon wafer
Product

silica nanoparticle-loaded trichloro(1H, 1H, 2H, 2H-perfluorooctyl)silane, nickel-coated silicon wafer

Size: ~ 20 nm

Thickness: 50 nm

Trench spacing: 2500 nm

Trench width: 1200 nm

Medium/Support: none

Method 4

Type: Physical formation
Source:
Starting materials
  • silicon wafer
Product

silica nanoparticle-loaded trichloro(1H, 1H, 2H, 2H-perfluorooctyl)silane, nickel-coated silicon wafer

Size: ~ 20 nm

Thickness: 50 nm

Medium/Support: none

Method 5

Type: Physical formation
Source:
Starting materials
  • silicon wafer
Product

silica nanoparticle-loaded trichloro(1H, 1H, 2H, 2H-perfluorooctyl)silane, nickel-coated silicon wafer

Size: ~ 20 nm

Thickness: 50 nm

Trench spacing: 3000 nm

Trench width: 3000 nm

Medium/Support: none

References

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