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copper seed layer on tantalum/silicon dioxide/silicon trench substrate

Based on

1 Articles
2011 Most recent source

Composition

Image only illustrates the order and placement of components as described in literature.

1

tantalum/silicon dioxide/silicon trench substrate

Ta/SiO2/Si trench substrate
Type Nano Material
Formula
Role layer
2

copper

Type Single Compound
Formula Cu
Role layer

Applications

Area Application Nanomaterial Variant Source
electronics

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Characterization

Method Nanomaterial Variant Source
scanning electron microscopy

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Preparation

Method 1

Type: Chemical synthesis
Source:
Starting materials
  1. 0TAxSKn3dNTjsp9tBa
  2. CEsIFdCOqbHfVGgT7APV
  3. lyPCmDqarkmYWZ8bzyUMBMXDuckswgt6Sxu4CnNxObBSs6ok366ZHOzVNNjWmxnLxZp
  4. a2dBX26z865HTu0HYtcS1H6HEHN8WQqYFMPvsWjlha
  5. 5ZIi6
  6. jtDD36EamvrRysAIDmKa7bs3RYYyS5
  7. ZVL9NzZQYf20fbTWmN6hRA1otbcCnuyM5s2946KTbgyItiLnmHAX0lUDpHYFbMXHlxAGapkRGKHsXZN4RqaCXkWQq7eOg6WwcSE75RR8tjodlhY1ovLFbAwFVBzls3JloYbDXyDa9b
Product

copper seed layer on tantalum/silicon dioxide/silicon trench substrate

Thickness: ~ 500 nm

Medium/Support: none

References

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