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CuInP2S6 flakes

Based on

2 Articles
2016 Most recent source

Composition

Image only illustrates the order and placement of components as described in literature.

1

copper indium thiophosphate

CIPS
Type Single Compound
Formula CuInP2S6
Role raw materials

Properties

General physical and chemical properties

Property Value Nanomaterial Variant Source
effective longitudinal piezoelectric coefficient

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Applications

Area Application Nanomaterial Variant Source
data storage

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Characterization

Method Nanomaterial Variant Source
atomic force microscopy

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Preparation

Method 1

Type: Physical formation
Source:
Starting materials
  • copper indium thiophosphate
Product

CuInP2S6 flakes

Thickness: 20 - 100 nm

Medium/Support: none

Method 2

Type: Physical formation
Source:
Starting materials
  • doped silicon
  • copper indium thiophosphate
Product

CuInP2S6 flakes

Thickness: 7 - 100 nm

Medium: none

Support: doped silicon

Method 3

Type: Physical formation
Source:
Starting materials
  • copper indium thiophosphate
Product

CuInP2S6 flakes

Thickness: 20 nm

Medium/Support: none

Method 4

Type: Physical formation
Source:
Starting materials
  • copper indium thiophosphate
Product

CuInP2S6 flakes

Thickness: 5 - 40 nm

Medium/Support: none

Method 5

Type: Physical formation
Source:
Starting materials
  • copper indium thiophosphate
Product

CuInP2S6 flakes

Thickness: 10 nm

Medium/Support: none

References

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