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lamellae-patterned XPS/ZEP520A

Based on

1 Articles
2015 Most recent source

Composition

Image only illustrates the order and placement of components as described in literature.

1

cross-linkable polystyrene

XPS
Type Polymer
Formula
Role layer
2

ZEP520A e-beam resist

Type Complex Compound
Formula
Role layer

Applications

Area Application Nanomaterial Variant Source
nanoprinting/nanolithography

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Characterization

Method Nanomaterial Variant Source
scanning electron microscopy

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Preparation

Method 1

Type: Physical formation
Source:
Starting materials
  1. l3ZbfoG0cOHNUGQsx3YbQXEmn4E
Product

lamellae-patterned XPS/ZEP520A

Interlamellar spacing: 54 nm

Thickness: 7 - 8 nm

Medium: none

Support: silicon

Method 2

Type: Physical formation
Source:
Starting materials
  1. TXyklltrC0y1tmvNmy5ZUZ4BT5x
Product

lamellae-patterned XPS/ZEP520A

Interlamellar spacing: 54 nm

Thickness: 7 - 8 nm

Medium: none

Support: silicon

Method 3

Type: Physical formation
Source:
Starting materials
  • silicon
  • cross-linkable polystyrene
  1. ZCXTdOv05EHb4OPp6onsidPx2HebYiykIbJm4
Product

lamellae-patterned XPS/ZEP520A

Thickness: 50 nm

Thickness: 7 - 8 nm

Medium: none

Support: silicon

Method 4

Type: Physical formation
Source:
Starting materials
  1. yD2bmvVvQOKd1IHLTPIInrreDNN
Product

lamellae-patterned XPS/ZEP520A

Interlamellar spacing: 50 nm

Thickness: 7 - 8 nm

Medium: none

Support: silicon

Method 5

Type: Physical formation
Source:
Starting materials
  1. JV6dRbgFt7CTfPL9JaMjaiJV9QH
Product

lamellae-patterned XPS/ZEP520A

Interlamellar spacing: 44 nm

Thickness: 7 - 8 nm

Medium: none

Support: silicon

References

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