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SiOCH low-κ dielectric porous material

Based on

1 Articles
2014 Most recent source

Composition

Image only illustrates the order and placement of components as described in literature.

1

organosilicate

Type Complex Compound
Formula
Role raw materials

Properties

General physical and chemical properties

Property Value Nanomaterial Variant Source
Porosity

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Characterization

Method Nanomaterial Variant Source
infrared spectroscopy

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Preparation

Method 1

Type: Chemical synthesis
Source:
Product

SiOCH low-κ dielectric porous material

Pore radius: 5.45 - 10.8 nm

Thickness: 127 - 129 nm

Medium/Support: none

Method 2

Type: Chemical synthesis
Source:
Product

SiOCH low-κ dielectric porous material

Pore radius: 2.9 - 11.1 nm

Thickness: 123 - 125 nm

Medium/Support: none

Method 3

Type: Chemical synthesis
Source:
Product

SiOCH low-κ dielectric porous material

Pore radius: 5.6 - 11.4 nm

Thickness: 126 - 128 nm

Medium/Support: none

Method 4

Type: Chemical synthesis
Source:
Product

SiOCH low-κ dielectric porous material

Pore radius: 2.8 - 11.4 nm

Thickness: 182 - 184 nm

Medium/Support: none

References

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