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multi-layered Cu/Si thin film

Based on

1 Articles
2015 Most recent source

Composition

Image only illustrates the order and placement of components as described in literature.

1

copper

Type Single Compound
Formula Cu
Role layer
2

silicon

Type Single Compound
Formula Si
Role layer

Properties

General physical and chemical properties

Property Value Nanomaterial Variant Source
cyclic voltammogram dependent on cycle number

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Characterization

Method Nanomaterial Variant Source
dielectric spectroscopy

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Preparation

Method 1

Type: Physical formation
Source:
Starting materials
  • stainless steel
  • copper
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Product

multi-layered Cu/Si thin film

Thickness: 200 nm

Thickness: 50 nm

Medium: none

Support: stainless steel

Method 2

Type: Physical formation
Source:
Starting materials
  • silicon
  • copper
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  3. Rps0r
  4. WSfRI7CwQ7eocivGP
Product

multi-layered Cu/Si thin film

Thickness: 200 nm

Thickness: 50 nm

Thickness: 580 nm

Medium: none

Support: silicon

Method 3

Type: Physical formation
Source:
Starting materials
  • copper
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  2. nVJc2c5WVkIse0op
  3. eyZlS
  4. 8pzWMMH3uCFWwzphm
Product

multi-layered Cu/Si thin film

Thickness: 200 nm

Thickness: 50 nm

Medium: none

Support: copper

Method 4

Type: Physical formation
Source:
Starting materials
  • soda-lime-silica glass
  • copper
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  2. TvZONEMxEBo5QZy4
  3. Uglwg
  4. faGoVWvtimclHf30i
Product

multi-layered Cu/Si thin film

Thickness: 200 nm

Thickness: 50 nm

Medium: none

Support: soda-lime-silica glass

References

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