Loading ...

chiral mesoporous silica

Based on

1 Articles
2015 Most recent source

Composition

Image only illustrates the order and placement of components as described in literature.

1

silicon dioxide

silicic oxide silica
Type Single Compound
Formula SiO2
Role binder
2

(N-(β-aminoethyl)-γ-aminopropyltrimethoxysilane)

[N-(2-aminoethyl)-3-aminopropyl]trimethoxysilane (3-((2-aminoethyl)amino)propyl)trimethoxysilane (N-β-(aminoethyl)-γ-aminopropyltrimethoxysilane N-(2-aminoethyl)-3-(trimethoxysilyl)propylamine N-[3-(trimethoxysilyl)propyl]-1,2-ethanediamine N-(2-aminoethyl)-3-aminopropyltrimethoxysilane N-(2-aminoethyl)-3 aminopropyltrimethoxysilane N-2-(aminoethyl)-3-aminopropyltrimethoxysilane N-[3-(trimethoxysilyl)-propyl]ethylenediamine N-[3-(trimethoxysilyl)propyl] ethylenediamine N-[3-(trimethoxysilyl)propyl]-ethylenediamine [3-(2-aminoethylamino)propyl]trimethoxysilane N-[3-(trimethoxysilyl)propyl]ethylenediamine N-(3-(trimethoxysilyl)propyl)ethylenediamine N-[(3-trimethoxysilyl)propyl]ethylenediamine (3-aminoethylamino)propyl(trimethoxy)silane 3-(2-aminoethyl)aminopropyltrimethoxysilane 3-(2-aminoethylamino)propyltrimethoxysilane N-(tri-methoxysilylpropyl)ethylenediamine 3-aminopropyltrimethoxysilane 2-AE-3-APTMS en-APTAS A-112.0 AEAPTMS N-APTMS 2APTMS AEAPMS KH-792 Z 6020 AAPTS AEAPS AO700 TMPED U-15D AAPS DAMO DMAO EDAS EDPS TMED TMSD TPED TDS N-3 APS TSD
Type Single Compound
Formula C8H22N2O3Si
Role fillers

Applications

Area Application Nanomaterial Variant Source
catalysis

More information available to subscribers only.

Or, view sample content

Characterization

Method Nanomaterial Variant Source
differential thermal analysis

More information/entries available to subscribers only.

Or, view sample content

Preparation

Method 1

Type: Chemical synthesis
Source:
Starting materials
  • N-myristoyl-L-alanine
  1. oUagPJi9dEX7hmc
  2. tB2wzO
  3. XYC2wrvjSznxaCeO
Product

chiral mesoporous silica

Diameter: ~ 100 - 200 nm

Length: < 500 nm

Pore diameter: ~ 2.61 nm

Medium/Support: none

References

Full content is available to subscribers only

To view content please choose from the following:

We use cookies to improve your experience with our site. More information

Sign up for a free trial