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β-Sn-CeO2 nanoparticles-Cu6Sn5 IMC-Ag3Sn IMC/(Cu,Ni)-Sn IMC layer/Cu

Based on

1 Articles
2014 Most recent source

Composition

1

(Cu,Ni)-Sn IMC

Type Complex Compound
Formula
Role layer
2

β-Sn-CeO2 composite solder

Type Nano Material
Formula
Role layer
3

silver-tin intermetallic compound

silver-tin alloy silver-tin IMC Ag-Sn alloy Ag3Sn IMC
Type Single Compound
Formula Ag3Sn
Role fillers
4

copper-tin intermetallic compound

copper-tin intermetallic compound copper tin alloy copper-tin alloy copper-tin IMC Cu-Sn alloy Cu6Sn5 IMC Cu6Sn5
Type Single Compound
Formula Cu6Sn5
Role fillers

Properties

General physical and chemical properties

Property Value Nanomaterial Variant Source
microhardness

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Characterization

Method Nanomaterial Variant Source
field emission scanning electron microscopy

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Preparation

Method 1

Type: Chemical synthesis
Source:
Starting materials
  1. MrO2V3pSf4z44PU1JV
Product

β-Sn-CeO2 nanoparticles-Cu6Sn5 IMC-Ag3Sn IMC/(Cu,Ni)-Sn IMC layer/Cu

Thickness: ~ 5000 nm

Medium: none

Support: copper

Method 2

Type: Chemical synthesis
Source:
Starting materials
  1. QIiZYXycUfDNuYqper
Product

β-Sn-CeO2 nanoparticles-Cu6Sn5 IMC-Ag3Sn IMC/(Cu,Ni)-Sn IMC layer/Cu

Thickness: ~ 4500 nm

Medium: none

Support: copper

Method 3

Type: Chemical synthesis
Source:
Starting materials
  1. Tbtxi3e42iq8aDdCeJ
Product

β-Sn-CeO2 nanoparticles-Cu6Sn5 IMC-Ag3Sn IMC/(Cu,Ni)-Sn IMC layer/Cu

Thickness: 3780 nm

Medium: none

Support: copper

Method 4

Type: Chemical synthesis
Source:
Starting materials
  1. mGr1dIKKN9HxchNskf
Product

β-Sn-CeO2 nanoparticles-Cu6Sn5 IMC-Ag3Sn IMC/(Cu,Ni)-Sn IMC layer/Cu

Thickness: ~ 4200 nm

Medium: none

Support: copper

Method 5

Type: Chemical synthesis
Source:
Starting materials
  1. sZy1tK1HYrM4uDNm3d
Product

β-Sn-CeO2 nanoparticles-Cu6Sn5 IMC-Ag3Sn IMC/(Cu,Ni)-Sn IMC layer/Cu

Thickness: ~ 4000 nm

Medium: none

Support: copper

References

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