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carbon nanotubes-incorporated electroless Ni-P under bump metallization

Based on

1 Articles
2014 Most recent source

Composition

Image only illustrates the order and placement of components as described in literature.

1

Ni-P

Type Complex Compound
Formula
Role binder
2

polyvinylpyrrolidone-coated oxidized multiwalled carbon nanotubes

PVP-coated oxidized multiwalled CNT
Type Nano Material
Formula
Role fillers

Characterization

Method Nanomaterial Variant Source
atomic force microscopy

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Preparation

Method 1

Type: Chemical synthesis
Source:
Starting materials
See all (4)
  1. s8E5klWKHvCWEXMP
  2. q8T4cAf1zFi8aUabmHY3EFMDKZKODJ6YN94Bca52hDW9rkSm18WA0zzdf9Nl0I
  3. lzapUQaFPbHr3lWPYo5DmJSBW37O
Product

carbon nanotubes-incorporated electroless Ni-P under bump metallization

RMS roughness: 24 nm

Roughness: 121 nm

Size: 1000 - 2000 nm

Medium/Support: none

Method 2

Type: Chemical synthesis
Source:
Starting materials
See all (4)
  1. VBgUNDt1xyeFTxCO
  2. eNAndBWhm67ks06MjEptP5uPZibsI8aOlZNscYyhN3p7cvwHvU6Ug0NZHUuCz2
  3. PL4AY1RLKbnIdoqAr
Product

carbon nanotubes-incorporated electroless Ni-P under bump metallization

Size: 1000 - 2000 nm

Medium/Support: none

References

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