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PEEK HP3/epoxy bonding composite/microcrystalline layered metallic construct

Based on

1 Patents
2014 Most recent source

Composition

Image only illustrates the order and placement of components as described in literature.

1

polyetheretherketone HP3

PEEK HP3
Type Polymer
Formula
Role layer
2

epoxy-based bonding material

Type Complex Compound
Formula
Role layer
3

nickel

Type Single Compound
Formula Ni
Role layer
4

copper

Type Single Compound
Formula Cu
Role layer
5

nickel

Type Single Compound
Formula Ni
Role layer

Properties

General physical and chemical properties

Property Value Nanomaterial Variant Source
peel strength

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Preparation

Method 1

Type: Chemical synthesis
Source:
Starting materials
  • silicon dioxide
  • polyetheretherketone HP3
  • rubber
See all (5)
  1. vMjiSbIZDPIg9i59phFFrOA17CHlR8Kbg
  2. TkjkXMHSoaUXJrZh0B73luUEpoQH0M56nm06Ldq0XsDkpIvwCv3QrConLPQMMn
Product

PEEK HP3/epoxy bonding composite/microcrystalline layered metallic construct

Grain size: < 100 nm

Thickness: 100000 nm

Medium/Support: none

References

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