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Cu dots/TiN thin film on SiO2/n+-doped Si

Based on

1 Articles
2014 Most recent source

Composition

Image only illustrates the order and placement of components as described in literature.

1

silicon dioxide

silicic oxide silica
Type Single Compound
Formula SiO2
Role layer
2

titanium nitride

Type Single Compound
Formula TiN
Role layer
3

tantalum

Type Single Compound
Formula Ta
Role layer
4

copper

Type Single Compound
Formula Cu
Role layer

Properties

General physical and chemical properties

Property Value Nanomaterial Variant Source
barrier performance characteristic time

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Applications

Area Application Nanomaterial Variant Source
electronics

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Preparation

Method 1

Type: Chemical synthesis
Source:
Starting materials
  • oxygen
  • n-doped Si
Product

Cu dots/TiN thin film on SiO2/n+-doped Si

Dot diameter: 500000 nm

Thickness: 100 nm

Thickness: 200 nm

Thickness: 300 nm

Thickness: 50 nm

Medium: none

Support: n-doped Si

Method 2

Type: Chemical synthesis
Source:
Starting materials
  • oxygen
  • n-doped Si
Product

Cu dots/TiN thin film on SiO2/n+-doped Si

Dot diameter: 500000 nm

Thickness: 100 nm

Thickness: 200 nm

Thickness: 25 nm

Thickness: 300 nm

Medium: none

Support: n-doped Si

Method 3

Type: Chemical synthesis
Source:
Starting materials
  • oxygen
  • n-doped Si
Product

Cu dots/TiN thin film on SiO2/n+-doped Si

Dot diameter: 500000 nm

Thickness: 100 nm

Thickness: 200 nm

Thickness: 300 nm

Thickness: 84 nm

Medium: none

Support: n-doped Si

Method 4

Type: Chemical synthesis
Source:
Starting materials
  • oxygen
  • n-doped Si
Product

Cu dots/TiN thin film on SiO2/n+-doped Si

Dot diameter: 500000 nm

Thickness: 100 nm

Thickness: 200 nm

Thickness: 300 nm

Thickness: 5 nm

Medium: none

Support: n-doped Si

Method 5

Type: Chemical synthesis
Source:
Starting materials
  • oxygen
  • n-doped Si
Product

Cu dots/TiN thin film on SiO2/n+-doped Si

Dot diameter: 500000 nm

Thickness: 100 nm

Thickness: 200 nm

Thickness: 300 nm

Thickness: 42 nm

Medium: none

Support: n-doped Si

References

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