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solidified SAC105-55Sb solder

Based on

1 Articles
2014 Most recent source

Composition

1

tin

Type Single Compound
Formula Sn
Role raw materials
2

tin-silver alloy

Type Complex Compound
Formula
Role raw materials
3

copper tin intermetallic compound

copper-tin intermetallic compound copper tin alloy copper-tin alloy copper-tin IMC Cu-Sn alloy Cu6Sn5 IMC Cu6Sn5
Type Single Compound
Formula Cu6Sn5
Role fillers
4

nanoscale Ag3Sn intermetallic compounds

nanoscale Ag3Sn dispersoids nanoscale Ag3Sn IMC
Type Nano Material
Formula
Role fillers
5

antimony

Type Single Compound
Formula Sb
Role dopant

Properties

General physical and chemical properties

Property Value Nanomaterial Variant Source
creep shear strain

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Characterization

Method Nanomaterial Variant Source
energy dispersive X-ray spectroscopy

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Preparation

Method 1

Type: Chemical synthesis
Source:
Starting materials
  • antimony-doped tin-silver-copper alloy
  1. dUAGtwiwwvMopWHQjolPxmF6OV
Product

solidified SAC105-55Sb solder

Radius: ~ 25.5 nm

Size: 1150 nm

Medium/Support: none

Method 2

Type: Chemical synthesis
Source:
Starting materials
  • manganese-doped tin-silver-copper alloy
  1. 9egmjqqQBrAfitmpRN77dhaROI
Product

solidified SAC105-55Sb solder

Radius: ~ 27 nm

Size: 1840 nm

Medium/Support: none

References

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