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Cu film

Based on

83 Articles
2 Patents
2018 Most recent source

Composition

1

copper

Type Single Compound
Formula Cu
Role raw materials

Properties

General physical and chemical properties

Property Value Nanomaterial Variant Source
electrical resistivity

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resistivity
sheet resistance

Catalytic properties

Reaction Value Nanomaterial Variant Source
carbon dioxide electroreduction

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Applications

Area Application Nanomaterial Variant Source
catalysis

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Characterization

Method Nanomaterial Variant Source
atomic force microscopy

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scanning electron microscopy
UV
UV-Vis-NIR optical spectroscopy
X-ray diffraction

Preparation

Method 1

Type: Chemical synthesis
Source:
Starting materials
  • copper(II) sulphate
  1. 0xFnjcH3kkk68i2lXbkCf13rnHN
  2. 48BCu
Product

Cu film

Thickness: ~ 65 nm

Medium/Support: none

Method 2

Type: Physical formation
Source:
Starting materials
  • quartz
  • copper
Product

Cu film

Thickness: 40 nm

Medium: none

Support: quartz

Method 3

Type: Chemical synthesis
Source:
Starting materials
  • copper(II) sulphate
  1. JjWagv7sMDv62PsBtoGySvgakiW
  2. UtSg0
Product

Cu film

Thickness: ~ 55 nm

Medium/Support: none

Method 4

Type: Chemical synthesis
Source:
Starting materials
  • copper(II) dimethylamino-2-propoxide
  1. PQNtweQmkBENfU8SIjyKkwOpChT
  2. hkqXB
  3. Ao42aTI1Y1GAEwl2aY
  4. xACm2OeAs3UllFHcurLk
  5. zeVNEBwzb5OTDOO2kmymUmddbTG9
Product

Cu film

Thickness: 20 nm

Medium/Support: none

Method 5

Type: Chemical synthesis
Source:
Starting materials
  • copper(II) dimethylamino-2-propoxide
  1. sjBEBBjagZDBk2AqN8Gcw9KdwIh
  2. XezzT
  3. ePpQeU0c7ve3MDakMarNpp
  4. 2uhBzS5Tbt8rkZ7W7c
  5. zH8dfKjTXqn9jmGFaLyj5EiCA38w
Product

Cu film

Thickness: 15 nm

Medium/Support: none

References

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