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Based on

91 Articles
2 Patents
2018 Most recent source

Composition

1

copper

Type Single Compound
Formula Cu
Role raw materials

Properties

General physical and chemical properties

Property Value Nanomaterial Variant Source
electrical resistivity

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resistivity
sheet resistance

Catalytic properties

Reaction Value Nanomaterial Variant Source
carbon dioxide electroreduction

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Applications

Area Application Nanomaterial Variant Source
catalysis

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Characterization

Method Nanomaterial Variant Source
atomic force microscopy

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scanning electron microscopy
transmission electron microscopy
UV
UV-Vis-NIR optical spectroscopy
X-ray diffraction
X-ray photoelectron spectroscopy

Preparation

Method 1

Type: Physical formation
Source:
Starting materials
  • copper
  • glass-like carbon
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Product

copper film

Thickness: 100 nm

Medium: none

Support: glass-like carbon

Method 2

Type: Physical formation
Source:
Starting materials
  • copper
  • Mylar ™
Product

copper film

Thickness: 60-80 nm

Medium: none

Support: Mylar ™

Method 3

Type: Physical formation
Source:
Starting materials
  • copper
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  2. sAOFoj
Product

copper film

Cluster size: ~ 2 nm

Medium/Support: none

Method 4

Type: Chemical synthesis
Source:
Starting materials
  • copper(II) dimethylamino-2-propoxide
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  5. x7oKWynnqWEXRirLOdfhswOwZYOI
Product

copper film

Thickness: 15 nm

Medium/Support: none

Method 5

Type: Chemical synthesis
Source:
Starting materials
  • copper(II) dimethylamino-2-propoxide
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  3. 1RAsVqo82j4M3gF6SI
  4. 0gwPTEv9Hnbbv3pHnoxXfK9IWNodMzwBAa
  5. dDc709dbRBjEY9vjXRCjSi1UaA53
Product

copper film

Thickness: ~ 14 nm

Medium/Support: none

References

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