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Cu film

Based on

88 Articles
2 Patents
2018 Most recent source

Composition

1

copper

Type Single Compound
Formula Cu
Role raw materials

Properties

General physical and chemical properties

Property Value Nanomaterial Variant Source
electrical resistivity

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resistivity
sheet resistance

Catalytic properties

Reaction Value Nanomaterial Variant Source
carbon dioxide electroreduction

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Applications

Area Application Nanomaterial Variant Source
catalysis

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Characterization

Method Nanomaterial Variant Source
atomic force microscopy

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scanning electron microscopy
transmission electron microscopy
UV
UV-Vis-NIR optical spectroscopy
X-ray diffraction
X-ray photoelectron spectroscopy

Preparation

Method 1

Type: Physical formation
Source:
Starting materials
  • copper
  • glass-like carbon
  1. ISGQTGgDFHJYPkvYhuUeWMY6MP
Product

Cu film

Thickness: 100 nm

Medium: none

Support: glass-like carbon

Method 2

Type: Physical formation
Source:
Starting materials
  • copper
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  2. Mv0cID
Product

Cu film

Cluster size: ~ 2 nm

Medium/Support: none

Method 3

Type: Chemical synthesis
Source:
Starting materials
  • copper(II) dimethylamino-2-propoxide
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  2. nJ2KW
  3. AbsEc0IBFXrJvWcubwf4dh
  4. xw72B8EHWpIofn6QyI
  5. pbQEJmS9ToeCFAe2f3KpJZmrcGr8
Product

Cu film

Thickness: 15 nm

Medium/Support: none

Method 4

Type: Chemical synthesis
Source:
Starting materials
  • copper(II) dimethylamino-2-propoxide
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  2. AELms
  3. uoIZummu6hRB71t6bX
  4. MHhceX5GpKkgoALLZ6FogypxtD4D70qUI9
  5. C6O3A17JFhrFkfyMfu8Zmb1G3uPz
Product

Cu film

Thickness: ~ 14 nm

Medium/Support: none

Method 5

Type: Chemical synthesis
Source:
Starting materials
  • copper(II) dimethylamino-2-propoxide
  1. DrgV50u0hjV9BmZrxfhMN5FhgJb
  2. 13P3z
  3. OXDGpgzUFwQveZdgXf4RfE
  4. oIR1HJAl6Cyrw8rYUO
Product

Cu film

Thickness: 17 nm

Medium/Support: none

References

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