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porous Cu nanoparticles-assembled film

Based on

4 Articles
2017 Most recent source

Composition

Image only illustrates the order and placement of components as described in literature.

1

copper nanoparticles

Cu nanoparticles
Type Nano Material
Formula
Role raw materials

Properties

General physical and chemical properties

Property Value Nanomaterial Variant Source
electrical resistivity

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Applications

Area Application Nanomaterial Variant Source
protection

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Characterization

Method Nanomaterial Variant Source
atomic emission spectroscopy

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Biological effects

Preparation

Method 1

Type: Physical formation
Source:
Starting materials
  • copper
  1. Hx2kOz0HHlUdU
  2. 6cuNh
Product

porous Cu nanoparticles-assembled film

Size: not specified

Medium: none

Support: copper

Method 2

Type: Physical formation
Source:
Starting materials
  • copper
Product

porous Cu nanoparticles-assembled film

Size: not specified

Medium/Support: none

Method 3

Type: Physical formation
Source:
Starting materials
  • copper
  1. GCTAVNj6O8qeN2XEVTIeF3r
  2. 34RU5ng59r9DtjhG2fsQklrKRDCtpzACkEjwCdGDHyxgzEqY3xJ7nnf
  3. svLzIIRxsiz32Y25F
Product

porous Cu nanoparticles-assembled film

Thickness: 290 - 310 nm

Medium/Support: none

Method 4

Type: Chemical synthesis
Source:
Starting materials
  • Na-free glass
  • dibutylammonium salt of Cu(II) complex with ethylenediamine-N,N,N',N'-tetraacetic acid ligand
  • copper(II) diformate
  1. P54K3BjbpuN0jwCl
  2. FZr5kKNDoRVCohdfGNUNU1
  3. szBA5Bjg5i3l
Product

porous Cu nanoparticles-assembled film

Grain size: 50 nm

Thickness: 50 nm

Medium: none

Support: Na-free glass

Method 5

Type: Physical formation
Source:
Starting materials
  • copper
  1. KDwcXFaYs8j32
  2. Mvt9Z
Product

porous Cu nanoparticles-assembled film

Size: not specified

Medium: none

Support: copper

References

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