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soldering paste composition

Based on

1 Patents
2011 Most recent source

Composition

1

mixture of substance based on (diethylene glycol monohexyl ether/hexanedioic acid/modified rosin/castor wax)

Type Complex Compound
Formula
Role binder
2

malonic acid acid-inclusion glucopyranosylamine nanotubes

Type Nano Material
Formula
Role fillers
3

solder powder

Type Complex Compound
Formula
Role raw materials

Properties

General physical and chemical properties

Property Value Source
change in viscosity

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Applications

Area Application Source
engineering

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Characterization

Biological effects

Preparation

Method 1

Type: Physical formation
Source:
Starting materials
  1. Ff2Sqlj
Product

soldering paste composition

References

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