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Ta/Cu/Py/Cu/SiO2 film on Si/SiO2

Based on

1 Articles
2016 Most recent source

Composition

Image only illustrates the order and placement of components as described in literature.

1

tantalum

Type Single Compound
Formula Ta
Role layer
2

copper

Type Single Compound
Formula Cu
Role layer
3

Ni79Fe21

Type Single Compound
Formula Ni79Fe21
Role layer
4

copper

Type Single Compound
Formula Cu
Role layer
5

silicon dioxide

silicic oxide silica
Type Single Compound
Formula SiO2
Role layer

Properties

General physical and chemical properties

Property Value Source
Gilbert damping parameter

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Applications

Characterization

Biological effects

Preparation

Method 1

Type: Physical formation
Source:
Starting materials
  • tantalum
  • Si wafer
  1. nOn0At
Product

Ta/Cu/Py/Cu/SiO2 film on Si/SiO2

Method 2

Type: Physical formation
Source:
Starting materials
  • tantalum
  • Si wafer
  1. qfulBa
Product

Ta/Cu/Py/Cu/SiO2 film on Si/SiO2

Method 3

Type: Physical formation
Source:
Starting materials
  • tantalum
  • Si wafer
  1. 0ZEMBU
Product

Ta/Cu/Py/Cu/SiO2 film on Si/SiO2

Method 4

Type: Physical formation
Source:
Starting materials
  • tantalum
  • Si wafer
  1. EDnT9g
Product

Ta/Cu/Py/Cu/SiO2 film on Si/SiO2

Method 5

Type: Physical formation
Source:
Starting materials
  • tantalum
  • Si wafer
  1. iUqN3v
Product

Ta/Cu/Py/Cu/SiO2 film on Si/SiO2

References

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