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Co-TCPP(Fe) film

Based on

15 Articles
2017 Most recent source

Composition

Image only illustrates the order and placement of components as described in literature.

1

1,3,5-tris[4-(4'-2,2':6',2''-terpyridyl)phenyl]benzene

1,3,5-tris(4-(2,2':6',2''-terpyridyl)phenyl)-benzene 1,3,5-tri(4-terpyridinephenylene)benzene trident terpyridine ligand L
Type Single Compound
Formula C69H45N9
Role framework element
2

Zn2(SO4)2

Type Single Compound
Formula Zn2(SO4)2
Role framework element

Properties

General physical and chemical properties

Property Value Nanomaterial Variant Source
band gap

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Catalytic properties

Reaction Value Nanomaterial Variant Source
aerobic oxacycloalkane photooxidation

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Sensor properties

Type of sensor Sensor property Nanomaterial Variant Source
compounds sensor for DNA

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Applications

Area Application Nanomaterial Variant Source
catalysis

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Characterization

Method Nanomaterial Variant Source
atomic force microscopy

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selected area electron diffraction
transmission electron microscopy
UV
UV-Vis spectroscopy
X-ray diffraction

Biological effects

Biological system Test details Nanomaterial Variant Source
murine colon adenocarcinoma CT26 cells

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Preparation

Method 1

Type: Physical formation
Source:
Starting materials
  1. oP14XA1
  2. uyDGu
Product

Co-TCPP(Fe) film

Thickness: 209.1 - 240.9 nm

Thickness: 3.8 - 7.4 nm

Medium: none

Support: Si wafer

Method 2

Type: Physical formation
Source:
Starting materials
  1. vgFUNHx
  2. SLNmm
Product

Co-TCPP(Fe) film

Thickness: 3.8 - 7.4 nm

Thickness: 332.1 - 371.9 nm

Medium: none

Support: indium tin oxide glass

Method 3

Type: Chemical synthesis
Source:
Starting materials
  • zinc chloride
  • histidine-modified L-rhamnulose-1-phosphate aldolase
  • MOPS buffer
  1. 8ss1
Product

Co-TCPP(Fe) film

Hydrodynamic diameter: ~ 600 nm

Size: ~ 300 - ~ 1000 nm

Medium: MOPS buffer

Support: none

Method 4

Type: Physical formation
Source:
Starting materials
  1. LTycgo2
  2. cdYzg
Product

Co-TCPP(Fe) film

Thickness: 3.8 - 7.4 nm

Thickness: 86.1 - 103.9 nm

Medium: none

Support: Si wafer

Method 5

Type: Physical formation
Source:
Starting materials
  1. 87FOXW2
  2. DMXpr
Product

Co-TCPP(Fe) film

Thickness: 3.8 - 7.4 nm

Thickness: 52.7 - 63.3 nm

Medium: none

Support: indium tin oxide glass

References

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