Loading ...

Glycidyl POSS-coated silicon wafer film

Based on

1 Articles
2015 Most recent source

Composition

Image only illustrates the order and placement of components as described in literature.

1

poly (C40H72O28Si8)

Type Polymer
Formula
Role raw materials

Properties

Applications

Characterization

Method Nanomaterial Variant Source
optical microscopy

More information available to subscribers only.

Or, view sample content

Biological effects

Preparation

Method 1

Type: Chemical synthesis
Source:
Starting materials
  • mixture of substance based on (propylene glycol monomethyl ether acetate/propylene glycol monomethyl ether acetate/Genocure isopropyl thioxanthone/Genocure isopropyl thioxanthone/Irgacure 250/Irgacure 250/C40H72O28Si8/C40H72O28Si8)
  • silicon wafer
Product

Glycidyl POSS-coated silicon wafer film

Thickness: ~ 50 nm

Trenches depth: ~ 45 nm

Trenches pitch: ~ 500 nm

Trenches width: ~ 270 nm

Medium: none

Support: silicon wafer

Method 2

Type: Chemical synthesis
Source:
Starting materials
  • mixture of substance based on (propylene glycol monomethyl ether acetate/propylene glycol monomethyl ether acetate/Genocure isopropyl thioxanthone/Genocure isopropyl thioxanthone/Irgacure 250/Irgacure 250/C40H72O28Si8/C40H72O28Si8)
  • silicon wafer
Product

Glycidyl POSS-coated silicon wafer film

Residual layer thickness: ~ 15 nm

Trenches depth: ~ 50 nm

Trenches pitch: ~ 500 nm

Trenches width: ~ 270 nm

Medium: none

Support: silicon wafer

References

Full content is available to subscribers only

To view content please choose from the following:

We use cookies to improve your experience with our site. More information

Sign up for a free trial