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3D composite microarchitecture

Based on

1 Articles
2014 Most recent source

Composition

1

IP-Dip photoresist

Type Polymer
Formula
Role core
2

aluminium oxide

aluminum oxide alumina
Type Single Compound
Formula Al2O3
Role layer

Properties

General physical and chemical properties

Property Value Nanomaterial Variant Source
compressive strength

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Applications

Characterization

Method Nanomaterial Variant Source
scanning electron microscopy

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Biological effects

Preparation

Method 1

Type: Physical formation
Source:
Starting materials
  • IP-Dip photoresist
Product

3D composite microarchitecture

Thickness: ~ 50 nm

Medium/Support: none

Method 2

Type: Physical formation
Source:
Starting materials
  • IP-Dip photoresist
Product

3D composite microarchitecture

Thickness: ~ 100 nm

Medium/Support: none

Method 3

Type: Physical formation
Source:
Starting materials
  • IP-Dip photoresist
Product

3D composite microarchitecture

Thickness: ~ 100 nm

Medium/Support: none

Method 4

Type: Physical formation
Source:
Starting materials
  • IP-Dip photoresist
Product

3D composite microarchitecture

Thickness: ~ 100 nm

Medium/Support: none

Method 5

Type: Physical formation
Source:
Starting materials
  • IP-Dip photoresist
Product

3D composite microarchitecture

Thickness: ~ 50 nm

Medium/Support: none

References

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