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copper seed layer on tantalum/silicon dioxide/silicon trench substrate

Based on

1 Articles
2011 Most recent source

Composition

Image only illustrates the order and placement of components as described in literature.

1

silicon dioxide

silicic oxide silica
Type Single Compound
Formula SiO2
Role layer
2

tantalum

Type Single Compound
Formula Ta
Role layer
3

copper

Type Single Compound
Formula Cu
Role layer

Properties

Applications

Area Application Nanomaterial Variant Source
electronics

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Characterization

Method Nanomaterial Variant Source
scanning electron microscopy

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Biological effects

Preparation

Method 1

Type: Chemical synthesis
Source:
Starting materials
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  4. EcTSSq38oitOJy2eSBQUJjtj1F4tHdZm9ylf9EzNz2
  5. koZjz
  6. QmQyLUrXwVNlXPizrgpn0CJLhy0BRUmk
  7. westpgdSPjgLMXGn4113qNfZ2EsmKogihYpv6Uhb1nSt09RHq5RNVkyFia58Jnjh5BgcDiIoEfinb4iec111ATIa62VIBp6BdMrYBCD5Pueu5viOG1jHdZReEeOEBgivJe4G6MsZhX
Product

copper seed layer on tantalum/silicon dioxide/silicon trench substrate

Thickness: 100 nm

Thickness: 3 nm

Thickness: 5 - 7 nm

Trench width: 32 nm

Medium: none

Support: silicon

References

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