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Cu/Ta stack on Si/SiO2 substrate

Based on

2 Articles
2017 Most recent source

Composition

Image only illustrates the order and placement of components as described in literature.

1

tantalum

Type Single Compound
Formula Ta
Role layer
2

single crystal copper

copper fcc-Cu
Type Single Compound
Formula Cu
Role layer

Properties

Applications

Characterization

Method Nanomaterial Variant Source
scanning tunneling microscopy

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Biological effects

Preparation

Method 1

Type: Physical formation
Source:
Starting materials
  • tantalum
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Product

Cu/Ta stack on Si/SiO2 substrate

RMS roughness: 0.5 nm

Thickness: 20 - 50 nm

Thickness: 7 nm

Medium/Support: none

Method 2

Type: Physical formation
Source:
Starting materials
  • tantalum
  • Si/SiO2
Product

Cu/Ta stack on Si/SiO2 substrate

Thickness: 10 nm

Thickness: 60 nm

Medium: none

Support: Si/SiO2

References

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