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multi-layered Cu/Si thin film

Based on

1 Articles
2015 Most recent source

Composition

Image only illustrates the order and placement of components as described in literature.

1

copper

Type Single Compound
Formula Cu
Role layer
2

silicon

Type Single Compound
Formula Si
Role layer

Properties

General physical and chemical properties

Property Value Nanomaterial Variant Source
cyclic voltammogram dependent on cycle number

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Applications

Characterization

Method Nanomaterial Variant Source
dielectric spectroscopy

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Biological effects

Preparation

Method 1

Type: Physical formation
Source:
Starting materials
  • silicon
  • copper
  1. 4obK5bV2FR3GhIdTR
  2. p66TDObYN9xFD3tG
  3. rsxOx
  4. xUWzO3tvIY9TrCHyL
Product

multi-layered Cu/Si thin film

Thickness: 200 nm

Thickness: 50 nm

Thickness: 580 nm

Medium: none

Support: silicon

Method 2

Type: Physical formation
Source:
Starting materials
  • copper
  1. 3yltHhHVEbQkd2thy
  2. 86Vr3viA2weaMfSt
  3. T07C0
  4. AwB4AX5EK10bkL9r3
Product

multi-layered Cu/Si thin film

Thickness: 200 nm

Thickness: 50 nm

Medium: none

Support: copper

Method 3

Type: Physical formation
Source:
Starting materials
  • stainless steel
  • copper
  1. gnvIOOXqhVo4SdiTX
  2. vzPb1mjqcm9R9dHr
  3. 3muuf
  4. UeQgjb3fRjH6AuUp1
Product

multi-layered Cu/Si thin film

Thickness: 200 nm

Thickness: 50 nm

Medium: none

Support: stainless steel

Method 4

Type: Physical formation
Source:
Starting materials
  • soda-lime-silica glass
  • copper
  1. b7ivvZPggLkS4omMC
  2. X0I0jKd440YuWHSH
  3. qCVdf
  4. OGd4GTM3cRZnT8F7k
Product

multi-layered Cu/Si thin film

Thickness: 200 nm

Thickness: 50 nm

Medium: none

Support: soda-lime-silica glass

References

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