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Sn-Ag-Cu-CeO2 composite solder/Cu6Sn5 IMC/Ag3Sn layer/(Cu,Ni)-Sn IMC layer/Cu

Based on

1 Articles
2014 Most recent source

Composition

1

(Cu,Ni)-Sn IMC

Type Complex Compound
Formula
Role layer
2

silver-tin intermetallic compound

silver-tin alloy silver-tin IMC Ag-Sn alloy Ag3Sn IMC
Type Single Compound
Formula Ag3Sn
Role layer
3

copper tin intermetallic compound

copper-tin intermetallic compound copper tin alloy copper-tin alloy copper-tin IMC Cu-Sn alloy Cu6Sn5 IMC Cu6Sn5
Type Single Compound
Formula Cu6Sn5
Role partial layer
4

β-Sn-CeO2 composite solder

Type Nano Material
Formula
Role layer

Properties

Applications

Characterization

Method Nanomaterial Variant Source
energy dispersive X-ray spectroscopy

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Biological effects

Preparation

Method 1

Type: Chemical synthesis
Source:
Starting materials
  1. 4q7ocvl605XhTkjNDs
Product

Sn-Ag-Cu-CeO2 composite solder/Cu6Sn5 IMC/Ag3Sn layer/(Cu,Ni)-Sn IMC layer/Cu

Thickness: ~ 3000 nm

Medium: none

Support: copper

References

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