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β-Sn-CeO2 nanoparticles-Cu6Sn5 IMC-Ag3Sn IMC/(Cu,Ni)-Sn IMC layer/Cu

Based on

1 Articles
2014 Most recent source

Composition

1

(Cu,Ni)-Sn IMC

Type Complex Compound
Formula
Role layer
2

β-Sn-CeO2 composite solder

Type Nano Material
Formula
Role layer
3

silver-tin intermetallic compound

silver-tin alloy silver-tin IMC Ag-Sn alloy Ag3Sn IMC
Type Single Compound
Formula Ag3Sn
Role fillers
4

copper tin intermetallic compound

copper-tin intermetallic compound copper tin alloy copper-tin alloy copper-tin IMC Cu-Sn alloy Cu6Sn5 IMC Cu6Sn5
Type Single Compound
Formula Cu6Sn5
Role fillers

Properties

General physical and chemical properties

Property Value Nanomaterial Variant Source
microhardness

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Applications

Characterization

Method Nanomaterial Variant Source
field emission scanning electron microscopy

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Biological effects

Preparation

Method 1

Type: Chemical synthesis
Source:
Starting materials
  1. fFQczcsJ4RPPGgiAQS
Product

β-Sn-CeO2 nanoparticles-Cu6Sn5 IMC-Ag3Sn IMC/(Cu,Ni)-Sn IMC layer/Cu

Thickness: ~ 5000 nm

Medium: none

Support: copper

Method 2

Type: Chemical synthesis
Source:
Starting materials
  1. FCroGvBjW2KEdizatL
Product

β-Sn-CeO2 nanoparticles-Cu6Sn5 IMC-Ag3Sn IMC/(Cu,Ni)-Sn IMC layer/Cu

Thickness: 3780 nm

Medium: none

Support: copper

Method 3

Type: Chemical synthesis
Source:
Starting materials
  1. UEVZmBF5R5c9wLuNFH
Product

β-Sn-CeO2 nanoparticles-Cu6Sn5 IMC-Ag3Sn IMC/(Cu,Ni)-Sn IMC layer/Cu

Thickness: ~ 4500 nm

Medium: none

Support: copper

Method 4

Type: Chemical synthesis
Source:
Starting materials
  1. 6j3MUXf0Bp8C4qMwVF
Product

β-Sn-CeO2 nanoparticles-Cu6Sn5 IMC-Ag3Sn IMC/(Cu,Ni)-Sn IMC layer/Cu

Thickness: ~ 4000 nm

Medium: none

Support: copper

Method 5

Type: Chemical synthesis
Source:
Starting materials
  1. w4y3cZPd6i1VR7QBPe
Product

β-Sn-CeO2 nanoparticles-Cu6Sn5 IMC-Ag3Sn IMC/(Cu,Ni)-Sn IMC layer/Cu

Thickness: ~ 4200 nm

Medium: none

Support: copper

References

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