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Sn-Ag-Cu-CeO2 composite solder/Cu6Sn5 IMC layer/Cu

Based on

1 Articles
2014 Most recent source

Composition

Image only illustrates the order and placement of components as described in literature.

1

copper tin intermetallic compound

copper-tin intermetallic compound copper tin alloy copper-tin alloy copper-tin IMC Cu-Sn alloy Cu6Sn5 IMC Cu6Sn5
Type Single Compound
Formula Cu6Sn5
Role layer
2

Sn-Ag-Cu-CeO2 composite solder

Type Nano Material
Formula
Role layer

Properties

Applications

Characterization

Method Nanomaterial Variant Source
energy dispersive X-ray spectroscopy

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Biological effects

Preparation

Method 1

Type: Chemical synthesis
Source:
Starting materials
  1. 2OJIaRfATYypPfAOlr
Product

Sn-Ag-Cu-CeO2 composite solder/Cu6Sn5 IMC layer/Cu

Thickness: ~ 2500 nm

Medium: none

Support: copper

References

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