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Y2O3 nanoparticles-doped Sn-3Ag-0.5Cu solder

Based on

1 Articles
2013 Most recent source

Composition

1

copper-tin intermetallic compound

copper-tin intermetallic compound copper tin alloy copper-tin alloy copper-tin IMC Cu-Sn alloy Cu6Sn5 IMC Cu6Sn5
Type Single Compound
Formula Cu6Sn5
Role partial layer
2

Sn-3Ag-0.5Cu solder

Type Complex Compound
Formula
Role layer
3

Y2O3 nanoparticles

Type Nano Material
Formula
Role dopant

Properties

Applications

Area Application Source
electronics

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Characterization

Method Source
scanning electron microscopy

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Biological effects

Preparation

Method 1

Type: Chemical synthesis
Source:
Starting materials
  1. s2bfVOm
Product

Y2O3 nanoparticles-doped Sn-3Ag-0.5Cu solder

References

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