Loading ...

Fast insight into nanotechnology

Access easily searchable nanoscience data, synthesis methods and literature

carbon nanotubes-incorporated electroless Ni-P under bump metallization

Based on

1 Articles
2014 Most recent source

Composition

Image only illustrates the order and placement of components as described in literature.

1

Ni-P

Type Complex Compound
Formula
Role binder
2

polyvinylpyrrolidone-coated oxidized multiwalled carbon nanotubes

PVP-coated oxidized multiwalled CNT
Type Nano Material
Formula
Role fillers

Properties

Applications

Characterization

Method Nanomaterial Variant Source
atomic force microscopy

More information/entries available to subscribers only.

Or, view sample content

Biological effects

Preparation

Method 1

Type: Chemical synthesis
Source:
Starting materials
See all (4)
  1. nP0ydf1ZwTtoRgDn
  2. LyccrPGBUfQNvVmFLfe5T2TixyAx3S7oRoyKo1qYeuO4UYJj4OGKjgWPL1UQtp
  3. RkNBKZEv7v6hOoPqMtpdYiBqgrFK
Product

carbon nanotubes-incorporated electroless Ni-P under bump metallization

RMS roughness: 24 nm

Roughness: 121 nm

Size: 1000 - 2000 nm

Medium/Support: none

Method 2

Type: Chemical synthesis
Source:
Starting materials
See all (4)
  1. q2uCejFL8X5UJvl5
  2. bT0teU1CKqhFv8JH5lZ3DPJFkC66bSg1ZIaTfubqCeUj9GQnLxeNX2JYKjnKSh
  3. XMREbkwrgLUitphiB
Product

carbon nanotubes-incorporated electroless Ni-P under bump metallization

Size: 1000 - 2000 nm

Medium/Support: none

References

Full content is available to subscribers only

To view content please choose from the following:

We use cookies to improve your experience with our site. More information

Sign up for a free trial