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carbon nanotubes-incorporated electroless Ni-P under bump metallization

Based on

1 Articles
2014 Most recent source

Composition

Image only illustrates the order and placement of components as described in literature.

1

Ni-P

Type Complex Compound
Formula
Role binder
2

polyvinylpyrrolidone-coated oxidized multiwalled carbon nanotubes

PVP-coated oxidized multiwalled CNT
Type Nano Material
Formula
Role fillers

Properties

Applications

Characterization

Method Source
atomic force microscopy

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Biological effects

Preparation

Method 1

Type: Chemical synthesis
Source:
Starting materials
See all (4)
  1. GcVRskk0M5buUwHV
  2. 3yiTdtl3MVv5yXK6S9pjG7tSrtvN2ntvu52DaKeTI75Rk72Taw8IOcFFPzmycE
  3. DuvICd1vQKJvkF48teNoaoEZbdlg
Product

carbon nanotubes-incorporated electroless Ni-P under bump metallization

Method 2

Type: Chemical synthesis
Source:
Starting materials
See all (4)
  1. ykNY0f6d3t3ESD92
  2. buLwP6ItQC2e6A9gahMiu8dvdYbmR9poaGJoHra1HOEeVXnURAEfufdKRDWTjP
  3. dOn0O6TF3KbDMaQPt
Product

carbon nanotubes-incorporated electroless Ni-P under bump metallization

References

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