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oxide film-covered tin-silver-copper solder alloy composition

Based on

1 Articles
2014 Most recent source

Composition

1

Sn-3.0Ag-0.5Cu

SAC305
Type Complex Compound
Formula
Role binder
2

Ag3Sn IMC NP

Type Nano Material
Formula
Role fillers
3

Cu6Sn5 IMC NP

Type Nano Material
Formula
Role fillers
4

substoichiometric tin oxide

tin oxide
Type Single Compound
Formula SnO(x)
Role layer

Properties

Applications

Area Application Source

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Characterization

Method Source

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Biological effects

Preparation

Method 1

Type: Chemical synthesis
Source:
Starting materials
  • Sn-3.0Ag-0.5Cu
  • oxygen
  1. pEyD6jsfr
  2. AiM5X0PTA7koXj
Product

oxide film-covered tin-silver-copper solder alloy composition

Method 2

Type: Chemical synthesis
Source:
Starting materials
  • Sn-3.0Ag-0.5Cu
  • oxygen
  1. lj5NwjWUW
  2. 2GdDztEg0mQclD
Product

oxide film-covered tin-silver-copper solder alloy composition

Method 3

Type: Chemical synthesis
Source:
Starting materials
  • Sn-3.0Ag-0.5Cu
  • oxygen
  1. yAe4f3LS2
  2. a3ssUs41EWDJZCh
Product

oxide film-covered tin-silver-copper solder alloy composition

Method 4

Type: Chemical synthesis
Source:
Starting materials
  • Sn-3.0Ag-0.5Cu
  • oxygen
  1. KqRjA5LzG
  2. 7VfHqSIkD5hEb9
Product

oxide film-covered tin-silver-copper solder alloy composition

Method 5

Type: Chemical synthesis
Source:
Starting materials
  • Sn-3.0Ag-0.5Cu
  • oxygen
  1. w8nF3kEeP
  2. Y8dn3gwzLPeKpz
Product

oxide film-covered tin-silver-copper solder alloy composition

References

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