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oxide film-covered tin-silver-copper solder alloy composition

Based on

1 Articles
2014 Most recent source

Composition

1

Sn-3.0Ag-0.5Cu

SAC305
Type Complex Compound
Formula
Role binder
2

Ag3Sn IMC NP

Type Nano Material
Formula
Role fillers
3

Cu6Sn5 IMC NP

Type Nano Material
Formula
Role fillers
4

substoichiometric tin oxide

tin oxide
Type Single Compound
Formula SnO(x)
Role layer

Properties

Applications

Area Application Source
electronics

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Characterization

Method Source
atomic force microscopy

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Biological effects

Preparation

Method 1

Type: Chemical synthesis
Source:
Starting materials
  • Sn-3.0Ag-0.5Cu
  • oxygen
  1. BVdGP13G6
  2. yO48UoAo9RLYg5
Product

oxide film-covered tin-silver-copper solder alloy composition

Method 2

Type: Chemical synthesis
Source:
Starting materials
  • Sn-3.0Ag-0.5Cu
  • oxygen
  1. YUOKjG9yd
  2. CXFzT4G9ylHYzx
Product

oxide film-covered tin-silver-copper solder alloy composition

Method 3

Type: Chemical synthesis
Source:
Starting materials
  • Sn-3.0Ag-0.5Cu
  • oxygen
  1. 29pIpuHlJ
  2. KhTZyuipi2zKEXV
Product

oxide film-covered tin-silver-copper solder alloy composition

Method 4

Type: Chemical synthesis
Source:
Starting materials
  • Sn-3.0Ag-0.5Cu
  • oxygen
  1. jaPZ3NCMr
  2. d9mKPAx0XxDuHp
Product

oxide film-covered tin-silver-copper solder alloy composition

Method 5

Type: Chemical synthesis
Source:
Starting materials
  • Sn-3.0Ag-0.5Cu
  • oxygen
  1. aP5q1lYVf
  2. a1zSuOtdJV953I
Product

oxide film-covered tin-silver-copper solder alloy composition

References

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