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tin-silver-copper solder alloy composition

Based on

1 Articles
2014 Most recent source

Composition

Image only illustrates the order and placement of components as described in literature.

1

Sn-3.0Ag-0.5Cu

SAC305
Type Complex Compound
Formula
Role binder
2

Ag3Sn IMC NP

Type Nano Material
Formula
Role fillers
3

Cu6Sn5 IMC NP

Type Nano Material
Formula
Role fillers

Properties

General physical and chemical properties

Property Value Nanomaterial Variant Source
corrosion

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Applications

Area Application Nanomaterial Variant Source
electronics

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Characterization

Method Nanomaterial Variant Source
transmission electron microscopy

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Biological effects

Preparation

References

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