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TiO2-containing tin-silver-copper composite solder

Based on

1 Articles
2013 Most recent source

Composition

Image only illustrates the order and placement of components as described in literature.

1

tin-silver-copper solder

Type Complex Compound
Formula
Role raw materials
2

titanium dioxide nanoparticles

titanium oxide nanoparticles titania nanoparticles TiO2 nanoparticles titania NP TiO2 NP
Type Nano Material
Formula
Role raw materials

Properties

General physical and chemical properties

Property Value Nanomaterial Variant Source
wettability

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Applications

Area Application Nanomaterial Variant Source
other

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Characterization

Method Nanomaterial Variant Source
differential scanning calorimetry

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Biological effects

Preparation

Method 1

Type: Physical formation
Source:
Starting materials
Product

TiO2-containing tin-silver-copper composite solder

Sphere diameter: ~ 17 - 33 nm

Medium/Support: none

Method 2

Type: Physical formation
Source:
Starting materials
Product

TiO2-containing tin-silver-copper composite solder

Sphere diameter: ~ 17 - 33 nm

Medium/Support: none

Method 3

Type: Physical formation
Source:
Starting materials
Product

TiO2-containing tin-silver-copper composite solder

Sphere diameter: ~ 17 - 33 nm

Medium/Support: none

References

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