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solidified Sn1.0Ag0.5Cu solder

Based on

1 Articles
2014 Most recent source

Composition

Image only illustrates the order and placement of components as described in literature.

1

tin

Type Single Compound
Formula Sn
Role raw materials
2

tin-silver alloy

Type Complex Compound
Formula
Role raw materials
3

copper tin intermetallic compound

copper-tin intermetallic compound copper tin alloy copper-tin alloy copper-tin IMC Cu-Sn alloy Cu6Sn5 IMC Cu6Sn5
Type Single Compound
Formula Cu6Sn5
Role fillers
4

nanoscale Ag3Sn intermetallic compounds

nanoscale Ag3Sn dispersoids nanoscale Ag3Sn IMC
Type Nano Material
Formula
Role fillers

Properties

General physical and chemical properties

Property Value Nanomaterial Variant Source
creep shear strain

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Applications

Characterization

Method Nanomaterial Variant Source
other

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Biological effects

Preparation

Method 1

Type: Chemical synthesis
Source:
Starting materials
  • tin-silver-copper alloy
  1. AaIfnABLXf1pCxDyGHefdeJnli
Product

solidified Sn1.0Ag0.5Cu solder

Radius: ~ 25 nm

Size: 4550 nm

Medium/Support: none

References

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