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solidified SAC105-05Mn solder

Based on

1 Articles
2014 Most recent source

Composition

1

tin

Type Single Compound
Formula Sn
Role raw materials
2

tin-silver alloy

Type Complex Compound
Formula
Role raw materials
3

copper-tin intermetallic compound

copper-tin intermetallic compound copper tin alloy copper-tin alloy copper-tin IMC Cu-Sn alloy Cu6Sn5 IMC Cu6Sn5
Type Single Compound
Formula Cu6Sn5
Role fillers
4

nanoscale Ag3Sn intermetallic compounds

nanoscale Ag3Sn dispersoids nanoscale Ag3Sn IMC
Type Nano Material
Formula
Role fillers
5

manganese

Type Single Compound
Formula Mn
Role dopant

Properties

General physical and chemical properties

Property Value Source
creep shear strain

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Applications

Characterization

Method Source
other

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Biological effects

Preparation

Method 1

Type: Chemical synthesis
Source:
Starting materials
  • manganese-doped tin-silver-copper alloy
  1. NexjaWkZnCofPWBDbzJe45kXUA
Product

solidified SAC105-05Mn solder

References

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