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tin deposited over copper-sputtered track-etched polycarbonate membrane

Based on

1 Articles
2014 Most recent source

Composition

1

tin

Type Single Compound
Formula Sn
Role layer
2

copper

Type Single Compound
Formula Cu
Role layer
3

track-etched polycarbonate film

track-etched PC film
Type Nano Material
Formula
Role template
4

example of metal nanowires

tin nanowires Sn nanowires
Type Nano Material
Formula
Role partial layer

Properties

Applications

Characterization

Biological effects

Preparation

Method 1

Type: Chemical synthesis
Source:
Starting materials
  1. WA5gkKvrbUYMLnSpJz3dWWWJnI208PqSna6kzwCcWKptN4HI0SyIrTnT7be5lm
  2. 7z8eVoJglG2lwxbRWvtOyLPltqBUX
Product

tin deposited over copper-sputtered track-etched polycarbonate membrane

Thickness: ~ 100 nm

Medium/Support: none

References

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