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binary blend MEH-PPV:PCBM film

Based on

36 Articles
1 Patents
2017 Most recent source

Composition

Image only illustrates the order and placement of components as described in literature.

1

DPP-TT-T

Type Polymer
Formula
Role binder
2

[6,6]-phenyl-C61-butyric acid methyl ester

PC60BM
Type Nano Material
Formula
Role fillers

Properties

General physical and chemical properties

Property Value Nanomaterial Variant Source
band gap

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Applications

Area Application Nanomaterial Variant Source
power generation

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Characterization

Method Nanomaterial Variant Source
atomic force microscopy

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photoluminescence
UV
UV-Vis spectroscopy

Biological effects

Preparation

Method 1

Type: Physical formation
Source:
Starting materials
  • poly(3-hexylthiophene)
  • [6,6]-phenyl-C61-butyric acid methyl ester
  1. 6z9gOhA09Ud38YyuZfjV1d
  2. ZYR0D
Product

binary blend MEH-PPV:PCBM film

Crystallite size: < 16 nm

Thickness: 95.65 nm

Medium/Support: none

Method 2

Type: Physical formation
Source:
  1. PN05ZYXdVDIMEKF
  2. msWgq9QKsJFkp
Product

binary blend MEH-PPV:PCBM film

Thickness: ~ 100 nm

Medium/Support: none

Method 3

Type: Physical formation
Source:
Starting materials
  • [6,6]-phenyl-C61-butyric acid methyl ester
  • "super yellow" poly(p-phenylene vinylene)
  1. 5DlVBUtf1S5l4
  2. FyDcY
  3. 5rzgt7
Product

binary blend MEH-PPV:PCBM film

Size: not specified

Medium/Support: none

Method 4

Type: Physical formation
Source:
Starting materials
  1. ETZaZ6gETmmcEHlmJLWarIqdnE0DOaQRovNV
  2. 0Qwj6zfbosGGxiP1bo7RhTRCzgQqzCzVuy4re8vOQl1kXQgcs1LNWKSalmsKiY
Product

binary blend MEH-PPV:PCBM film

Size: not specified

Medium: none

Support: Si/SiOx substrate

Method 5

Type: Physical formation
Source:
Starting materials
  • polystyrene
  1. xtxAK0iWy1cIt9CSYlW1lG6OzkRQquuCWUjI
Product

binary blend MEH-PPV:PCBM film

Thickness: 70 - 120 nm

Medium: none

Support: Si/SiOx substrate

References

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