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Cu film

Based on

75 Articles
2 Patents
2017 Most recent source

Composition

1

copper

Type Single Compound
Formula Cu
Role raw materials

Properties

General physical and chemical properties

Property Value Nanomaterial Variant Source
electrical resistivity

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resistivity
sheet resistance

Catalytic properties

Reaction Value Nanomaterial Variant Source
carbon dioxide reduction

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Applications

Area Application Nanomaterial Variant Source
catalysis

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Characterization

Method Nanomaterial Variant Source
atomic force microscopy

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scanning electron microscopy
UV
UV-Vis-NIR optical spectroscopy
X-ray diffraction

Biological effects

Preparation

Method 1

Type: Physical formation
Source:
Starting materials
  • copper
  1. bVQwzkHknfoMWDf6t
  2. TSX4Klf7VxFYDkYAksLTffmmmC6YhHWAKw5ZD6OKBI8gmmzSkPH92hQW53ixHzC7ZbXOk8ahXfIbNWOxZleCINAkl97q6r
Product

Cu film

Groove depth: ~ 60 nm

Groove width: ~ 170 nm

Thickness: ~ 60 nm

Medium/Support: none

Method 2

Type: Physical formation
Source:
Starting materials
  • copper
  1. DpCm5t7Wop2XWSse9
  2. HrmQQqxGmiM9bYcRCtUSNxEY9u4cUfKwrq7tLSKabAwEayVkPI7u81OnP9LeLZAk1egcvHpRixW8uhLkFXpnKI5lIlKEQw
Product

Cu film

Thickness: ~ 70 nm

Trench depth: ~ 70 nm

Medium/Support: none

Method 3

Type: Physical formation
Source:
Starting materials
Product

Cu film

Groove depth: ~ 10 - ~ 40 nm

Groove width: ~ 80 - ~ 200 nm

Thickness: ~ 70 nm

Medium: none

Support: cured Araldite rapid set epoxy

Method 4

Type: Physical formation
Source:
Starting materials
  • copper
  1. wIlePqsLpuetLwp
Product

Cu film

Thickness: 100 nm

Medium/Support: none

Method 5

Type: Physical formation
Source:
Starting materials
  • copper
  1. No83PfIbRoZklZbAN
  2. GG4IbDcacS8fVCmPqEi8P5oExIOlAYPjoNgunJvW0zzza0DN60FGC0FkfmgBvKhcCwg0lY2RM0mBsfUrjxZUq9LQvcP33P
Product

Cu film

Groove depth: ~ 60 nm

Groove width: ~ 60 - ~ 200 nm

Thickness: ~ 70 nm

Medium/Support: none

References

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