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flip chip based on CNT-CNT interconnected bumps

Based on

1 Articles
2013 Most recent source

Composition

1

gold

Type Single Compound
Formula Au
Role carrier coplanar waveguide
2

gold

Type Single Compound
Formula Au
Role die coplanar waveguides
3

multiwalled nitrogen-doped carbon nanotubes

N-doped MWCNT
Type Nano Material
Formula
Role interconnection bumps

Properties

General physical and chemical properties

Property Value Nanomaterial Variant Source
electric current

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Applications

Area Application Nanomaterial Variant Source
electronics

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Characterization

Method Nanomaterial Variant Source
scanning electron microscopy

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Biological effects

Preparation

Method 1

Type: Chemical synthesis
Source:
Starting materials
  • gold
Product

flip chip based on CNT-CNT interconnected bumps

Size: not specified

Medium/Support: none

References

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