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high-brightness light emitting diode

Based on

1 Articles
2011 Most recent source

Composition

1

copper

Type Single Compound
Formula Cu
Role substrate
2

thermal glue

epoxy layer
Type Polymer
Formula
Role conducting layer
3

carbon nanotubes

CNT
Type Nano Material
Formula
Role thermal dissipation layer
4

titanium

Type
Formula Ti
Role
5

gold

Type
Formula Au
Role
6

InGaN on sapphire

Type Complex Compound
Formula
Role integrated circuit chip

Properties

Applications

Area Application Source

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Characterization

Method Source

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Biological effects

Preparation

References

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